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Description
The HYW-2515 Desoldering Wick is a high-quality, professional-grade desoldering braid designed for the clean and efficient removal of excess solder from electronic circuit boards. Made from finely interwoven pure copper wire, this 2.5mm wide and 1.5m long wick utilizes high capillary action to draw molten solder away from components during repair, rework, or component replacement. It is coated with a special non-clean, non-corrosive rosin flux that accelerates solder absorption while protecting sensitive components from thermal damage.
## Key Features
* High Capillary Action: The geometric, high-density weave of pure copper maximizes surface tension to lift solder quickly and cleanly from PCB pads.
* Pre-Fluxed Braid: Coated with a mild, non-activated rosin flux that improves wetting and heat transfer, eliminating the need to apply external flux.
* Component Protection: Fast thermal response minimizes the heat transfer window to the circuit board, preventing damaged traces and overheated components.
* Residue-Free Formula: Leaves minimal, non-conductive, and non-corrosive residue behind, eliminating the mandatory cleaning step after desoldering.
## Technical Specifications
* Model Number: HYW-2515
* Material Composition: 100% Pure Copper (Cu)
* Braid Width: 2.5 mm (Ideal for medium-sized solder joints, thru-hole components, and standard SMD pads)
* Spool Length: 1.5 meters
* Flux Type: No-Clean Rosin
* Packaging: ESD-safe, anti-static plastic dispensing spool
## Common Applications
* Surface Mount Device (SMD) and through-hole component desoldering
* Cleaning residual solder from BGA pads and micro-controllers during chip replacement
* Correcting solder bridges, shorts, and excess solder blobs on prototype circuit boards
* General electronics repair, audio gear restoration, and mobile phone servicing
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